MID (Molded Interconnect Devices)
Creation of new devices using the 3D-MID laser process.
Sankyo Kasei Co., Ltd. provides a wide range of solutions from the development and prototyping of 3D-MID components to mass production, based on the technology and know-how accumulated over more than 30 years of MID production experience. [Features] ■ Circuit patterns can be formed on three-dimensional structures (molded products) regardless of the outer circumference, upper surface, or inner surface. ■ MID components that can be implemented with solder reflow are available. ■ Compatible with devices that have chip mounting and wire bonding.
- Company：三共化成
- Price：Other
